論文：
1. C. P. Feng, Chen L B, Tian G L, et al. Multifunctional Thermal Management Materials with Excellent Heat Dissipation and Generation Capability for Future Electronics. ACS Appl. Mater. Interfaces, 2019, 11, 18739-18745.（一區(qū)）
2. Shao Y#, Feng C P#, Deng B, et al. Facile method to enhance output performance of bacterial cellulose nanofiber based triboelectric nanogenerator by controlling micro-nano structure and dielectric constant. Nano Energy, 2019. 5: 078.（一區(qū)，TOP）
3. C. P. Feng, Chen L B, Tian G L, et al. Robust Polymer-based Paper-Like Thermal Interface Materials with a Through-Plane Thermal Conductivity over 9 Wm-1K-1. Chemical Engineering Journal. 2020，392，123784. （一區(qū)，TOP）
4. C. P. Feng, H. Y. Ni, J. Chen, and W. Yang. Facile Method to Fabricate Highly Thermally Conductive Graphite/PP Composite with Network Structures. ACS Appl. Mater. Interfaces 2016, 8, 19732-19738.（一區(qū)，TOP）
5. C. P. Feng, L. Bai, Y. Shao, R.Y. Bao, Z.Y. Liu, M. B. Yang, J. Chen, H. Y. Ni, W. Yang. Electrically insulating, layer structured SiR/GNPs/BN thermal management materials with enhanced thermal conductivity and breakdown voltage. Composites Science and Technology, 2018, 167: 456–462. （一區(qū)，TOP）
6. C. P. Feng, L. Bai, Y. Shao, R.Y. Bao, Z.Y. Liu, M. B. Yang, J. Chen, H. Y. Ni, W. Yang. A Facile Route to Fabricate Highly Anisotropic Thermal Conductive Elastomeric POE/NG Composites for Thermal Management. Adv. Mater. Interfaces. 2017, 1700946. （二區(qū)）
7. C. P. Feng, H. Y. Ni, J. Chen, and W. Yang. Highly thermally conductive UHMWPE/graphite composites with segregated structures. RSC Advances. 2016, 6, 65709–65713.
8. C. P. Feng, L. Bai, Y. Shao, R.Y. Bao, Z.Y. Liu, M. B. Yang, J. Chen, H. Y. Ni, W. Yang. Electrically insulating POE/BN elastomeric composites with high through-plane thermal conductivity fabricated by two-roll milling and hot compression. Adv Compos Hybrid Mater 2018, 1, 160–167. （二區(qū)）
9. C. P. Feng, Bai L, Bao R Y, et al. Superior thermal interface materials for thermal management. Composites Communications, 2019, 12: 80-85. （二區(qū)）
10.Yang, L. Y., Feng, C. P.*, Bai, L., Bao, R. Y., Liu, Z. Y., Yang, M. B., & Yang, W*. Flexible shape-stabilized phase change materials with passive radiative cooling capability for thermal management. Chemical Engineering Journal, 2021.425, 131466.（一區(qū)，TOP）
11.Wei, F., Feng, C. P. *, Yang, J., Yang, L. Y., Bai, L., Bao, R. Y., ... & Yang, W*. Scalable Flexible Phase Change Materials with a Swollen Polymer Network Structure for Thermal Energy Storage. ACS Appl. Mater. Interfaces.2021, https://doi.org/10.1021/acsami.1c20147 （一區(qū)，TOP）
12.Feng, C. P.; Sun, K. Y.; Ji, J. C.; Hou, L.; Cui, G. P.; Zhao, Z. G.; Lan, H. B., 3D Printable, form stable, flexible phase-change-based electronic packaging materials for thermal management. Additive Manufacturing 2023, 71, 103586.（一區(qū)，TOP）
13. Feng, C. P.; Sun, K.; Ji, J.; Cui, G.; Hou, L.; Shi, M.; Wei, F.; Yang, W., Flexible phase change materials for overheating protection of electronics. Journal of Energy Storage 2024, 84, 110719.（二區(qū)）
